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Paper-Phenolic Laminate GF

For stable production of printed-circuit-boards it is necessary to have an insulant with good mechanical properties and low cost. These qualities has copper-clad paper-based laminat GF (type XXP), made on the basis of a treating paper and phenol-formaldehyde resin. It is a traditionally produced material known for many producers of printed-circuit-boards. However technology of the given material does not cost on a place. The modernization of an impregnating machine has allowed to improve such performances, as distorting and appearance. The collateral operations with leading chemical institutes of Russian Federation in result have given that all kinds copper-clad paper-based laminates (GF, GOFVM, MI1112) are characterized by stable cohesion with a foil and stability to effect of melted welding alloy. Further, come to meet to wishes of our consumers, by scientific and technical centre of factory is developed and introduced into production the modified variant GF with an opportunity of punching without prewarming .

 

Conformity to standards
GOST 10316-78
NEMA LI-1 XXP
IEC 249 PF-CP-Cu
DIN 40802 PF-CP
Technical Characteristics
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GF

Parameters

Test conditions

Guaranteed values

Typical values

Temperature

Glass transition temperarure, Òg, o C

    85± 5

Electrical

Permittivity at 1MHz Ñ 96/40/93 7,0 4,8
Dissipation Factor at 1MHz Ñ 96/40/93 0,07 0,032
Surface Resistivity (Ohms), not less than Ñ 96/40/93 1,0 x 108 2,0 x 1012
Volume Resistivity,(Ohms), not less than Å - 1/100 5,0 x 107 5,0 x 108
Edge corrosion, N C 96/40/93 ÀÂ 1,6 ÀÂ 1,6

Physical

Peel Strength, N/mm, not less than normal conditions 1,3 1,4
after heat shock (260 o Ñ/30 sec) 1,3 1,4
Å - 1/125 1,3 1,4
Solder Float, sec, not less than 260 o Ñ 10 10
Bow/twist, %, not less than normal conditions 5 1,5
Moisture absorption, mg, not more than D - 24/23 60 50
Punching ability   1,0 1,0
temperature of puncing, o Ñ   60-90 60-90
Sheet sizes, mm   1200õ1040,      2450õ1040 1200õ1040,      2450õ1040
Thickness, mm   0,8-3,0 0,8-3,0
Identification symbol      
 
Application

GF is for today the cheapest material for printed-circuit-boards distinguished by good mechanical characteristics. Due to smaller hardness in comparison with glass fibre laminate term of use of stamps and drills is higher than at processing glass fibre laminate

 

 



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