GOFVMМ

Paper-Phenolic Laminate GOFVM

Copper-Clad Paper-Phenolic Laminate GOFVM with good moisture resistance (XXP), is made on the basis of a treated paper and phenol-formaldehyde resin .

Conformity to standards

GOST 10316-78

NEMA LI-1	XXXP
IEC 249	PF-CP-Cu
DIN 40802	PF-CP 02

Performance attributes

			GOFVM
Parameters	Test conditions	Guaranteed values	Typical values
*Temperature*
Glass transition temperarure, Тg, ^o C			85± 5
Electrical
Permittivity at 1MHz	С 96/40/93+ 1/23/75	5,5	5,5
Dissipation Factor at 1MHz	С 96/40/93+ 1/23/75	0,05	0,05
Surface Resistivity (Ohms), not less than	С 96/40/93	1,0 x 10⁹	1,0 x 10⁹
Volume Resistivity, not less than	С 96/40/93	1,0 x 10¹⁰	1,0 x 10¹⁰
Edge corrosion, N	А	АВ 1,6	АВ 1,6
Physical
Peel Strength, N/mm, not less than	normal conditions	1,33	1,33
	after heat shock (260 ^o С/30 sec)	1,33	1,33
	Е - 1/125	1,33	1,33
Solder Float, sec, not less than	260 ^o С	10	10
Bow/twist, %, not less than	normal conditions	5	5
Moisture absorption, not more than	D - 24/23	40	40
Flexural Strenght, N/sm2, not less then	normal conditions	8000	8000
punching		1,0	1,0
Punching temperature, ^o С		60-90	60-90
Sheet sizes, mm		1200х1040, 2450х1040	1200х1040, 2450х1040
Thickness, mm		0,8-3,0	0,8-3,0
Identification symbol

Application

GOFVM is intended for manufacturing printed-circuit-boards admitting operation in conditions of relative humidity up to 95 % at the temperature of 40 ^o С. A flameproof material.