Glass Epoxy Laminate SF

You want to produce the printed-circuit-board and do not want to pay for thermostability, inflammability? In that case you quite will be arranged with a glass-reinforced laminate copper-clad SF   (analog G-10), made on the basis of glass fabric and epoxy-phenol resin. It is the cheapest glass-reinforced laminate for printed-circuit-boards released by factory many of years and till now using great demand at the producer.

Conformity to standards

ГОСТ 10316-78    ГОСТ 26246.4-89

NEMA LI-1 G-10 IEC 249 EP-GC-Cu

Technical Characteristics

СФ Parameters Test conditions Guaranteed value Typical values Temperature Glass transition temperarure, Тg, o C     95± 5 Electrical Permittivity at 1MHz С  96/40/93+ 1/23/75 4,7 4,7 Dissipation Factor at 1MHz С  96/40/93+ 1/23/75 0,014 0,014 Surface Resistivity (Ohms), not less than Е - 1/125 1,0 x 109 1,0 x 109 Volume Resistivity, not less than Е - 1/125 6,5 x 1010 6,5 x 1010 Physical Peel Strength, N/mm, not less than normal conditions 4,8 4,8 after heat shock (260 o С/30 sec) 5,3 5,3 Е - 1/125 4,7 4,7 Solder Float, sec, not less than 260 o С 20 20 Bow/twist, %, not less than normal conditions 2 2 Moisture absorption, not more than D - 24/23 7,3 7,3 punching   1,0 1,0 Sheet sizes, mm   1010х890, 1220х1020, 1030x930, 1010x840, 910x890 1010х890, 1220х1020, 1030x930, 1010x840, 910x890 Thickness, mm   0,5-3,0 0,5-3,0 Identification symbol

Application

SF can be applied to production of printed-circuit-boards 1-2 classes of difficulty

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