Glass Epoxy Laminate STF

Your printed-circuit-board should have good electrical parameters at even at adverse environmental conditions and at elevated temperature? Then pick glass-reinforced plastics on pure epoxy resin. Well and if you furthermore do not want to pay for incombustibility of a material then stop a choice on glass-reinforced plastic heat-resistant copper-clad STF   (type G-10). CJSC "MOLDAVIZOLIT" - unique in CIS factory which produce this material.

Conformity to standards

ТУ 16-503.161-83

NEMA LI-1 G-10 IEC 249 EP-GC-Cu DIN 40802 EP-GC-01

Technical Characteristics

STF Parameters Test conditions Guaranteed values Typical values Temperature Glass transition temperarure, Тg, o C     >110± 5 Electrical Permittivity at 1MHz С - 40/23/50 4,7 4,7 Dissipation Factor at 1MHz С - 40/23/50 0,017 0,017 Surface Resistivity (Ohms), not less than Е - 1/125 5 x 1010 5 x 1010 Volume Resistivity, not less than Е - 1/125 7,0 x 109 7,0 x 109 Physical Peel Strength, N/mm, not less than after heat shock (260 o С/30 sec) 5,6 5,6 after plating 5,4 5,4 Solder Float, sec, not less than 260 o С 30 30 Bow/twist, %, not less than normal conditions 2,3 2,3 Moisture absorption, not more than D - 24/23 14,8 14,8 boiling resistance, hour normal conditions 1,5 1,5 punching   1,0 1,0 Sheet sizes, mm   1180х1030, 1220х1020, 1100x1000, 1010x900 1180х1030, 1220х1020, 1100x1000, 1010x900 Thickness, mm   0,8-3,0 Identification symbol

Application

STF can be applied to production of printed-circuit-boards of 1-4 classes of difficulty.

---